Power consumption due to R in metal stack is not a large proportion of total. There could be bigger opportunity in reducing wire delay though.
You see the same thing with external signals, like a connection between CPU and memory. Operate the bus at 1MHz and it is effectively DC. The signal has a wavelength of 300 meters, so when the signal travels a distance literally two orders of magnitude smaller across your motherboard the AC behavior is negligible. Operate that same bus at 1GHz and your wavelength is down to 30cm. Got a 40cm-wide motherboard? Better treat it like a transmission line or it isn't going to work!
[1] https://en.wikipedia.org/wiki/Pulse-amplitude_modulation
The reason for this multiphase design is because it offers better power efficiency and better transient response to the CPU as the CPU moves between it's different power states (high vs low load).
[1]: https://www.ti.com/lit/an/slva882b/slva882b.pdf?ts=169087951...
> In addition, various energy sources used for deposition are not limited to chemical vapor deposition (CVD) using heat, but atomic layer deposition (ALD), sputtering, and thermal evaporation, e-beam evaporation, molecular beam epitaxy (MBE), pulsed laser deposition (PLD), etc. are also included without limitation as long as the raw material can be deposited.
Listed methods are those used in semiconductor manufacturing to introduce materials to the wafers. It is also significant that the company's marketing material describes its resistance as "1/10^4 less than copper", because copper is currently used as a conductor in chips. (It wasn't always so, it used to be aluminium, which is a fascinating story itself. Read more on https://en.wikipedia.org/wiki/Copper_interconnects.)
https://patents.google.com/patent/WO2023027537/en