AirJet – The world’s first solid-state chip for active device cooling

Re:AirJet – The world’s first solid-state chip for active de... by vincnetas on Sunday January 22, 2023 @02:36AM (#34475243)

is it theoretically possible to have cooling paste be jelly like? so it just returns to previous position after cooling down? or its just to irrelevat problem to invest in it?

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Re:AirJet – The world’s first solid-state chip for active de... by rocqua on Sunday January 22, 2023 @02:39AM (#34475252)

It is, and thermal paste manufacturers need to balance performance against thermal cycling effects.

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Re:AirJet – The world’s first solid-state chip for active de... by ksec on Sunday January 22, 2023 @02:56AM (#34475339)

>is it theoretically possible to have cooling paste be jelly like?

That is already available and used in some Laptops. Look up Honeywell thermal pad.

The problem is as always, cost.

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Re:AirJet – The world’s first solid-state chip for active de... by numpad0 on Sunday January 22, 2023 @05:02AM (#34475919)

I thought thermal pads are generally thicker and less performant

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Re:AirJet – The world’s first solid-state chip for active de... by IlGrigiore on Sunday January 22, 2023 @05:31AM (#34476034)

There are thermal pads that perform equally or better than thermal pastes, due to their design. In particular, something like https://thermalmanagement.honeywell.com/us/en/products/therm... can be better than a good thermal paste like https://www.thermal-grizzly.com/en/products/16-kryonaut-en. The thermal conductivity is improved due to the use of a phase shifting material. Reliability is improved due to the fact that it will naturally return to solid without cracking during heat cycling.

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