e.g. the metal stack: One would like to connect transistors together. Copper is lower resistance than doped silicon, so we'd prefer to use copper. But there's a catch: copper diffuses into silicon. That is, if you attempt to directly plate copper onto silicon, some of the copper diffuses into the silicon crystal mucking up all the careful doping of the silicon we just did.
So we put down a barrier layer first: We first coat the silicon with tantalum nitride which has significantly lower diffusion rates into silicon. And then we put copper on. No! Wait! We can't put copper directly onto tantalum nitride for <complex reasons this margin is too small to contain>. So we put tantalum metal onto the nitride,and then we put copper onto that metal.
This is the sort of thing that referred to as a metal stack. I've hand-waved like crazy here. The actual metal stacks are way more complex than this.
The article alludes to some of the recent challenges: The tantalum nitride barrier layer is too thick so there's a move to replacing it with a cobalt based stack, or maybe even a manganese/ruthenium based stack.
The author had a pretty tough job in trying to explain some of what's going on to a lay audience and (likely) do it inside a word limit. We can argue about successful it was on the margins, but personally I'm still very appreciative that they tried :)
The author would have had an easier time staying within a word limit if they didn't say the same thing multiple times in a row everywhere. Honestly, it looks like they had exactly the opposite problem of what you're suggesting and were trying to fill more space without understanding the subject. Much of the article is just parroting redundant PR soundbites.
He completely ignores the extreme ultraviolet "light source" problem. As the features get smaller, light wavelengths are too big, and higher frequency light has to be used to get the wavelength down. Current technologies use ultraviolet light. The next step down in size is "extreme ultraviolet", which is actually soft X-rays. The "light source" can be either a synchrotron or an an incredibly expensive kludge where droplets of tin are vaporized by lasers.[1] 30KW of laser power goes in to produce maybe 100 watts of useful illumination. Two floors, tons of equipment. All this just to expose a photosensitive resist on the wafer.
At 14nm, the UV light source is a modest device. Getting to 7nm is enormously more complicated. 7nm may not be cheaper per gate.
> It will cost $271 million to design a 7nm chip, according to Gartner.
Not a million more, not a million less.
Wait, are you sure?
Really? I wouldn't have known that only people with more money can spend more money
The tape-out is completely separate from that. You need to do the physical layout and produce a set of lithographic masks that are incredibly expensive. Back in 2000, a set of masks for the most advanced technology at the time was already in the millions of dollars. Things have gotten ridiculously more complex since then.
> "companies A, B, C, and D are producing w, x, y, and z nm transisters"
> "you have to ignore what nm they used, because actually w nm = x/2 nm"
> continues to use company-specific nm instead of comparable units
> reminds you again that the numbers are not comparable
> continues to use company-specific nm instead of comparable units
> “We’ve also packed them closer together to improve transistor density,” said Kaizad Mistry
Yes, that is what density means. Very good!
> "And forming the gate itself is also challenging. “Cycle times are increasing for this step, driven by the complexity of the stack,” said Mohith Verghese, director of global product marketing at ASM International. “The metal gate stack is also getting very complicated."
Oh, it's getting challenging, complex, AND complicated!
> There are several layers in the metal stack.
I think you just told me that a stack of something has several layers. Also that the metal gate stack is metal.
> And issues, such as... all add to increased cycle time.”
So cycle times are increasing because issues lead to increased cycle time?
...
gah. I want to finish this, but it's just so hard to read a pile, with several layers of course, of redundant PR snippets.
...
> performance become limited, mainly by the contact and back-end-of-line, because those become the bottleneck.”
FFFFFFUUUUU
Christ on a cracker, get an editor. Oh...you ARE the editor. <cries>