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A comment on TSMC experimenting with rectangular wafers vs. round for more chips per wafer. Parent comment

Re:TSMC experimenting with rectangular wafers vs. round for ... by lawlessone on Friday June 21, 2024 @05:20PM (#40753942)
If we're suggesting shapes can I suggest one on the surface of pipe that wraps back around on itself? So I can run coolant through the middle.
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Re:TSMC experimenting with rectangular wafers vs. round for ... by themoonisachees on Saturday June 22, 2024 @02:07PM (#40760910)
I mean. The idea sounds fun but doing photolithography on a pipe's surface sounds like absolute hell.
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Re:TSMC experimenting with rectangular wafers vs. round for ... by ipjrms on Saturday June 22, 2024 @06:18PM (#40762710)
Hey, laser printers do it
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Re:TSMC experimenting with rectangular wafers vs. round for ... by themoonisachees on Monday June 24, 2024 @02:20AM (#40773026)
That's fair enough.
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