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A comment on TSMC unveils 1.6nm process technology with backside power delivery. Parent comment
230 M/mm2 translates to 33nm "half-pitch".
Of course, transistors aren't square and aren't so densely packed, but these numbers are more real IMO.
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230 M/mm2 translates to 33nm "half-pitch".
Of course, transistors aren't square and aren't so densely packed, but these numbers are more real IMO.