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A comment on TSMC unveils 1.6nm process technology with backside power delivery. Parent comment

Re:TSMC unveils 1.6nm process technology with backside power... by ahartmetz on Thursday April 25, 2024 @03:02PM (#40161650)
>EUV was cracked

More like it was started. There were a ton of gnarly problems left that took over ten years and billions of € to solve.

Producing a few flashes of EUV and getting a few photons on the target is relatively easy. Producing a lot of EUV for a long time and getting a significant fraction (...like 1%) of the photons on the target is very hard.

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Re:TSMC unveils 1.6nm process technology with backside power... by hajile on Thursday April 25, 2024 @06:27PM (#40163860)
EUV was supposed to ship in the early 2000s and the work on it started in earnest the 90s. It turned out that EUV is way harder than anyone imagined. The only reason we did stuff like immersion DUV was because we couldn’t get EUV to work.
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