Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic 32 GB Die

Re:Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic... by wtallis on Monday November 13, 2023 @12:19PM (#38252613)

Additionally, on-die ECC isn't unique to DDR5; it's a necessity for any DRAM built on the most recent high-density fab processes. It was used for at least some LPDDR4 memories, and probably most or all LPDDR5.

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Re:Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic... by jakobson14 on Monday November 13, 2023 @03:23PM (#38254887)

Can't wait to see another round of rowhammer papers trashing these things. XD

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Re:Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic... by dazed_confused on Monday November 13, 2023 @09:28PM (#38258218)

Row and col lines are so close nowadays; you are fighting physics... Older processes didn't have this problem due to row isolation.

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Re:Micron Introduces 128 GB DDR5-8000 RDIMMs with Monolithic... by jakobson14 on Tuesday November 14, 2023 @02:17PM (#38268102)

It's not the selection lines, up on higher metal layers. It's the actual memory cells themselves being too close together on the substrate.

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