Re:The future of computers: 3D chip stacking
by Symmetry on Wednesday March 07, 2012 @11:58AM
(#3676083)
I expect that what we'll see is a top layers of general purpose processing on top next to the heat sinks, then lower power layers further down, like maybe a layer of L3 cache then a stack of main memory. Probably also a lot of dark silicon which is only lit up for special tasks, like media encoding or encryption.
Stacking in itself has proven to be feasible by the Memory Cube. Where Heat isn't much of a concern.