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Re:The future of computers: 3D chip stacking by Symmetry on Wednesday March 07, 2012 @11:58AM (#3676083)
I expect that what we'll see is a top layers of general purpose processing on top next to the heat sinks, then lower power layers further down, like maybe a layer of L3 cache then a stack of main memory. Probably also a lot of dark silicon which is only lit up for special tasks, like media encoding or encryption.

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