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A comment on IBM and Samsung Unveil Semiconductor Breakthrough.

Re:IBM and Samsung Unveil Semiconductor Breakthrough by whatever1 on Wednesday December 15, 2021 @10:24PM (#29574431)
how do we cool all of the layers though? with single layer it’s easy, we just need to cover the top surface. With a 3d structure how can we do it efficiently? micro fluids ?
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Re:IBM and Samsung Unveil Semiconductor Breakthrough by craftit on Wednesday December 15, 2021 @11:20PM (#29574796)
That could be part of the reason why 85% drop in power consumption only leads to twice the perfomance.
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Re:IBM and Samsung Unveil Semiconductor Breakthrough by stunt on Thursday December 16, 2021 @02:55PM (#29583041)
Even this will be used in multi layers, like current chips. Aren't they already multi layer?
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Re:IBM and Samsung Unveil Semiconductor Breakthrough by marcyb5st on Thursday December 16, 2021 @04:59AM (#29576707)
Cooling heatpipes going through the chips? I was wondering the same for 3D stacked nand, but in that case the thermal output could be so low that you might not need to.
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Re:IBM and Samsung Unveil Semiconductor Breakthrough by jktogjfnn on Thursday December 16, 2021 @05:54AM (#29577028)
Maybe alternate each computing layer with a cooling layer made from gold (with holes for wires obviously).
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