Also, ASML’s EUV light source division was fairly recently (2013) acquired from... California. Cymer, LLC.
Retooling for EUV (or any new generation of such equipment) is very hard. Most (if not all) foundries build new factories rather than retooling old ones.
I know they're massive, but do you have a source for this? I was under the impression that construction and tool installation are two distinctly separate phases of construction due to the requirements for an immaculate environment. Also, my understanding is that companies like to bring the tools in as late as possible to shorten the delay between capex outlay (tools are expensive) and first production.
Unfortunately I don't have a more reliable source on that though.
Time, yields, line size.
Quadruple patterning quadrupples the lithography steps counts. And quadrupples thermal cycles. Which adds more than 4x impact on the number of bad wafers.
100% - 2% * 4 != 100% * 0.98⁴
You need 4x the equipment to complete the same volume of wafers in the same time, which means 4x the line length.
I don't see much retooling for anything below 45nm, if not 65nm.
As for lightsource, sure, that was/is a US company, but there's a lot more to a machine then just the light source.