I am not sure I have seen evidence for what you say. That is a complicated assertion because it speaks to wafer's started, wafer's finished, yield, die size, and technology among other things.
Honestly, I suspect that Intel's struggles (as per typical) with new technologies are around ossification of technical paths, struggles with yield, and copy-stupid. That leaves them struggling to produce the quantity that customers need, and has opened avenues for customers to find other routes that provide them with more control. They are also seeing the benefits of custom silicon and the possibilities of full stack optimization, as opposed to optimization of just one or two parts which largely drove older approaches to software/hardware/battery efficiency.
My other comment is that SPENDING on R&D is not always the best metric...
> The entire cost of Fab 18 will cost TSMC $17.08 billion.
Mind you, that's the 5nm production facility which is now complete and churning pretty good CPUs for Apple. They are also building a 3nm fab for 19.6 billion USD. Source https://www.taiwannews.com.tw/en/news/3805032
To leapfrog TSMC, we are quite probably looking at something like 40-50 billion USD in R&D and fab costs and that's a gambit because they are now behind. It's one hell of a gambit for a 200B market cap company.