Re:28Gbps Microstrip with Pepper Jack Cheese as Substrate (2...
by IndrekR on Tuesday August 27, 2019 @05:01AM
(#20807545)
> I wonder if there's any organic materials that would work even better.
PCBs are using mostly organic resin. Mechanical constraints limit many otherwise excellent dielectrics.
Also the cheese seems to have quite high loss tangent here. A quick test to this theory at 2.4 GHz involves a microwave oven, thermometer, pieces of RF laminate and dry cheese.
PCBs are using mostly organic resin. Mechanical constraints limit many otherwise excellent dielectrics.
Also the cheese seems to have quite high loss tangent here. A quick test to this theory at 2.4 GHz involves a microwave oven, thermometer, pieces of RF laminate and dry cheese.