Re:The Foundry at the Heart of DARPA’s Plan to Let Old Fabs ...
by kragormonkey on Tuesday August 07, 2018 @10:37PM
(#17712801)
Wrapping around sides isn't easy because chips are cut from a single large wafer pretty late in manufacturing. The sides aren't exposed until the end.
Besides, it won't help much. Usually when people want to shrink chips, it's often because shorter links. This means lower latency (ie faster) and lower heat loss. Wrapping or stacking doesn't help those.
Besides, it won't help much. Usually when people want to shrink chips, it's often because shorter links. This means lower latency (ie faster) and lower heat loss. Wrapping or stacking doesn't help those.