Re:A Design Defect Is Breaking iPhone 6 Pluses
by kalleboo on Tuesday September 06, 2016 @09:46AM
(#12435935)
And after all this discussion I'd bet Apple already fixed this with the 6s by simply stiffening the actual case...
Re:A Design Defect Is Breaking iPhone 6 Pluses
by pilsetnieks on Tuesday September 06, 2016 @11:05AM
(#12436507)
They did, they even said in the keynote that they're using a new aluminum alloy[1], and it's mentioned on the website as well[2]
[1] http://www.theverge.com/2015/9/12/9315471/iphone-6s-new-alum...
Re:A Design Defect Is Breaking iPhone 6 Pluses
by yincrash on Tuesday September 06, 2016 @10:56AM
(#12436433)
In the article, it's mentioned that in the 6S, the chip location has moved to where it's not near the most flexed area.
Re:A Design Defect Is Breaking iPhone 6 Pluses
by Retric on Tuesday September 06, 2016 @12:49PM
(#12437347)
Alternatively, let the case flex slightly and have the board float in a gap attaching to the center as apposed to the edges. You still need to connect the buttons to the main board, but that's not a major issue. basically: [---|--|---] with [ ] as edge, -- as board and | as attachment points.
This is not going to be as flat as possible, but it let's you play with some flex vs thin and completely stiff.
(Look at the smallest .04 x .02 resistors on there!)
More cynically, the PCB only needs to be made as bend-resistant as the display: you don't care about your BGAs if you've cracked the screen.
The article does mention a fix the repairers have been applying, involving the "sticker shield" - not shown in the hero image, it's the metal casing that's been removed and you can see the edges of. That's a few mils off the surface of the PCB and evidently stiffens it enough (on the I-beam principle of operation) to avert the problem.