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Re:Intel's 10nm 'Cannonlake' delayed, replaced by 14nm 'Kaby... by ZenoArrow on Monday July 06, 2015 @12:03PM (#9840078)
It'll be interesting to see the parts that silicon photonics and molecular assembly come to play in meeting the future process nodes.

I agree with those who say we'll reach a cost barrier before we reach a technical barrier. If I were to make a wild guess, I'd say 7nm will be that limit, and that it'll be about 5 years away (Moore's Law is already broken and isn't likely to be fixed any time soon, hence the slower timeframe).

Re:Intel's 10nm 'Cannonlake' delayed, replaced by 14nm 'Kaby... by marcosdumay on Monday July 06, 2015 @01:24PM (#9840691)
A cost barrier is the most common manifestation of a technical barrier.

There's no way silicon microlitography will keep working once transistors are just a few atoms big. In fact, at 10 nm tunnel currents should be already a big problem on all sides of the transistors, and not constrained to the gate - channel insulation anymore.

Re:Intel's 10nm 'Cannonlake' delayed, replaced by 14nm 'Kaby... by ZenoArrow on Monday July 06, 2015 @03:53PM (#9841770)
>"There's no way silicon microlitography will keep working once transistors are just a few atoms big."

That's why I mentioned molecular assembly.

>"In fact, at 10 nm tunnel currents should be already a big problem on all sides of the transistors, and not constrained to the gate - channel insulation anymore."

That's why I mentioned silicon photonics.

> "A cost barrier is the most common manifestation of a technical barrier."

It can be, but not always. We can definitely move beyond 7nm, we've already done it in the lab, but knowing if we can find ways to afford the costs of manufacturing below that point is not as clear.

http://www.purdue.edu/newsroom/research/2012/120219KlimeckAt...