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A comment on Using voltage glitching to unleash the A100 in my mining card. Parent comment

Re:Using voltage glitching to unleash the A100 in my mining ... by londons_explore on Wednesday November 11, 2026 @04:30PM (#50458978)
Do you not test the logic die before mounting the memory on top?
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Re:Using voltage glitching to unleash the A100 in my mining ... by monster_truck on Wednesday November 11, 2026 @08:05PM (#50461571)
back then, no
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Re:Using voltage glitching to unleash the A100 in my mining ... by octoberfranklin on Wednesday November 11, 2026 @11:53PM (#50463202)
Some testing can be done with a wafer probe, but other tests require stressing the die -- high current, heat output -- so it has to be in-package to do those tests.

Mounting the HBM on the interposer has to happen before putting the interposer in the package.

So it's the "must be in-package" yield tests that drive this.

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