Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

Re:Samsung is expected to more than double output of its HBM... by Taniwha on Monday September 21, 2026 @08:27PM (#49795296)

HBM dies are designed to be physically mounted on top of other dies in the same package, they can have up to 2048 data pins (compared to 8-64 on consumer dies which are in their own packaging) - to do what you propose you'd need an interposer chip of some type which would push the price back up

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Re:Samsung is expected to more than double output of its HBM... by m4rtink on Tuesday September 22, 2026 @07:39AM (#49799668)

If there is enough scrap chips & enough demand, I can still see it work.

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