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Re:macOS 26.2 enables fast AI clusters with RDMA over Thunde... by storus on Saturday December 13, 2025 @12:57PM (#46256455)
TSMC has a new tech that allows seamless integration of mini chiplets, i.e. you can add as many CPU/GPU cores in mini chiplets as you wish and glue them seamlessly together, at least in theory. The rumor is that TSMC had some issues with it which is why M5P and M5M are delayed.

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