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Note that BGA chips mostly come pre-soldered / solder balls. You also design PCBs so that there is a "well" for the balls to melt into and settle into place, and molten-solder has a significant amount of surface tension, so you can magically watch the solder "pull" your designs into place. Of course, the OP is likely talking about QFN not BGA, but... just in case people are worried about BGAs its not terrible... (its just impossible to inspect a BGA XRays).
The surface-tension can be harmful in the case of tombstoning (ex: a resistor or capacitor with two leads, especially a "sideways" low-inductance capacitor, will get "pulled up" by one side, lifting off the 2nd pad).
If you have a solder-plate + hot-gun, you can "feel" the surface tension by just grabbing a toothpick and pushing on these components as they're still hot. You'll find the pressure to be far higher than you expect.
I'll keep your experience in mind then. Thanks for sharing your experience.
[0] -- https://www.amazon.com/Soiiw-Microcomputer-Soldering-Preheat...
[1] -- https://www.chipquik.com/store/index.php?cPath=470&osCsid=8t...
[2] -- https://www.pololu.com/product/446/