That's the desired approach, yes, but... hot take incoming!
I think BGAs are easier to "hand" solder than other footprints (QFP, QFN etc). You drop the item in place, place it on a hot plate and or heat gun, and start melting it. Of course, if you screw it up, you are screwed. (Reballing sounds not worth it for most cases). And, you can't visually inspect.
I think this is because, at least for me, most of the soldering faults I have are due to uneven application, or improper amount of solder. BGA solves this.
I think BGAs are easier to "hand" solder than other footprints (QFP, QFN etc). You drop the item in place, place it on a hot plate and or heat gun, and start melting it. Of course, if you screw it up, you are screwed. (Reballing sounds not worth it for most cases). And, you can't visually inspect.
I think this is because, at least for me, most of the soldering faults I have are due to uneven application, or improper amount of solder. BGA solves this.