For this PCB, the smallest targets are about 0.2mm in diameter. In terms of precision robotics, this is very manageable. A robotic soldering iron, or even a laser soldering system, with a wire feeder and cutter could be used to make something like a rudimentary die-bonder, that simply solders the wires to the correct pads.

My background in process engineering made me lean towards a figuring out very manual process that could be automated, instead of figuring out a highly automated process.