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A comment on Intel, Samsung, and TSMC Demo 3D-Stacked Transistors. Parent comment

Re:Intel, Samsung, and TSMC Demo 3D-Stacked Transistors by markhahn on Sunday December 17, 2023 @10:56AM (#38673664)
stacking is a heat problem, and heat has been the PRIMARY system limit for over a decade.

2.5d is just too easy and effective - we're going to have lots more chiplets, and only the cool ones will get stacked.

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