Note that the shortage now is different than the past few years: it is not in fabricating any of the primary chips, it is entirely attributed to insufficient capacity in TSMC’s CoWoS packaging. This is only used for the highest-end accelerator products that use HBM (and a few other things that use full silicon interposers like Apple’s M-Ultras), they are scaling capacity, and there are increasing numbers of alternatives from other packaging vendors that chip designers could use if they had known TSMC’s packaging would be a bottleneck. Demand spiked a lot all of a sudden, and it just takes time to build factories – there are no obvious constraints.