Re:ASML to Ship First High-NA EUV Tool This Year: $300M per ...
by dist-epoch on Thursday September 07, 2023 @02:31PM
(#37423484)
> bomb-pumped x-ray lasers
For this to make sense you would need to expose multiple wafers on each detonation. But then you would need one mask per wafer, and masks are even harder to make than a chip (electron beam, ...)
For this to make sense you would need to expose multiple wafers on each detonation. But then you would need one mask per wafer, and masks are even harder to make than a chip (electron beam, ...)