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A comment on ASML to Ship First High-NA EUV Tool This Year: $300M per Scanner. Parent comment

Re:ASML to Ship First High-NA EUV Tool This Year: $300M per ... by Arrath on Thursday September 07, 2023 @01:58PM (#37422946)
> For a decade, people in wafer fab hoped there would be some other way to do this. Small synchrotrons. X-ray lasers. E-beam machines. But those approaches all fizzled out. So what ought to be a physics experiment run occasionally was hammered into being a production technology.

Now I'm imaging some retro-50s (ala Fallout) setting where the fancy chipmaking machines use bomb-pumped x-ray lasers. Swords into ploughshares taken too far? Maybe, but who cares!

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Re:ASML to Ship First High-NA EUV Tool This Year: $300M per ... by dist-epoch on Thursday September 07, 2023 @02:31PM (#37423484)
> bomb-pumped x-ray lasers

For this to make sense you would need to expose multiple wafers on each detonation. But then you would need one mask per wafer, and masks are even harder to make than a chip (electron beam, ...)

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