The future of computers: 3D chip stacking

Re:The future of computers: 3D chip stacking by roc on Wednesday March 07, 2012 @10:35AM (#3675792)

> "chip stacking obviously works in synergy with Intel’s 3D FinFETs — though curiously there is no sign of TSV on Intel’s roadmap"

Wouldn't chip stacking exacerbate heat dissipation issues? It seems to me that desktop chips would stand to gain far less from this approach, so why should it be surprising that Intel isn't rushing into it?

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Re:The future of computers: 3D chip stacking by ippisl on Wednesday March 07, 2012 @01:04PM (#3676387)

But what about servers ? memory bandwidth is the biggest problem facing servers, and stacking solves it nicely.

And when you put chips side by side like xilinx's new chip, the heating issue is solvable.

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Re:The future of computers: 3D chip stacking by cma on Wednesday March 07, 2012 @12:49PM (#3676327)

You would reduce mean distance between all components and, depending on the graph of connections, save a lot on resistance losses.

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Re:The future of computers: 3D chip stacking by IdahoEv on Wednesday March 07, 2012 @12:05PM (#3676121)

I wonder if you could etch channels for liquid coolant directly into every 3rd layer or so...

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Re:The future of computers: 3D chip stacking by wmf on Wednesday March 07, 2012 @12:11PM (#3676150)

http://www.eetimes.com/electronics-news/4077160/IBM-GIT-demo...

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