Costs millions per chip though.
Source: https://www.anandtech.com/show/16626/cerebras-unveils-wafer-...
Look at how successful AMD's chiplet strategy has been. Chiplets sidestep the yield problems. Wafer scale amplifies them hundred or thousand fold.
Nothing in the industry is designed to work with wafer scale products, so everything has to be custom made. Yes this is a chicken-egg problem, but it's going to be expensive to get any sort of momentum. The silicon industry is extremely conservative.
>It's sexy and enticing. If someone can make it work that's awesome. I will remain skeptical though.
But Cerebras has made it work since 2019 as @cubefox pointed out. They're on the second generation already and they have been shipping to customers for years.
Here's a good overview of how they did it: https://www.anandtech.com/show/14758/hot-chips-31-live-blogs...
SRAM is for data that needs to be read/written/used very frequently - for example, read in 1 out of 10 clock cycles.
LLM weights are certainly not this. If a GPU is calculating 200 tokens per second, then most weights are only used 200 times per second. For a 1 GHz GPU, you're only using the data for 1 cycle out of 5,000,000! The rest of the time, that SRAM is wasted power, wasted silicon area, and eventually wasted dollars.
Instead they should use SRAM for intermediate results (ie. the accumulators) of matrix multiplication - they will end up being read/written every few cycles.
Weights should be streamed in from in-package DRAM. Activations too (but they are often used multiple times in quick succession, so it might make sense to cache them in SRAM).
Also, a GPU is already an ASIC but with a fancy name.
Recent x64 chips are at about that amount of L3 cache which might be pretty similar. I've lost track of GPU hardware specs.
That proper hardware software co-design to mitigate communication? Viciously difficult bordering on imaginary.
There's still a lot of compromises and tradeoffs to be made:
> We observe that the inter-chiplet communication issues can be effectively mitigated through proper software-hardware co- design
Doubtful. Especially given it's all vapourware. Codesign is not adequately magic to handwave away this one.
A key architectural feature to achieve this is the ability to fit all model parameters inside the on-chip SRAMs of the chiplets to eliminate bandwidth limitations. Doing so is non-trivial as the amount of memory required is very large and growing for modern LLMs
...
On-chip memories such as SRAM have better read latency and read/write energy than external memories such as DDR or HBM but require more silicon per bit. We show this design choice wins in the competition of TCO per performance for serving large generative language models but requires careful consideration with respect to the chiplet die size, chiplet memory capacity and total number of chiplets to balance the fabrication cost and model performance (Sec.3.2.2) We observe that the inter-chiplet communication issues can be effectively mitigated through proper software-hardware co- design leveraging mapping strategies such as tensor and pipeline model parallelism