Re:A startup’s cooling chip may surge processor power
by willis936 on Thursday December 08, 2022 @09:46PM
(#33916781)
Indium gallium dries out. It needs annual repasting.
Also, using too much thermal paste is not an issue. What matters is mounting pressure and geometry. Replacing the bendy Independent Loading Mechanism (ILM) with an aftermarket square bracket. If you want to go further you can lap the IHS or even delid for direct-die cooling.
Delid for liquid metal TIM in between the IHS and die made sense for a few years, but Intel has switched backed to solder, so the only gain to be had with delidding these days is with direct die.
Also, using too much thermal paste is not an issue. What matters is mounting pressure and geometry. Replacing the bendy Independent Loading Mechanism (ILM) with an aftermarket square bracket. If you want to go further you can lap the IHS or even delid for direct-die cooling.
Delid for liquid metal TIM in between the IHS and die made sense for a few years, but Intel has switched backed to solder, so the only gain to be had with delidding these days is with direct die.