Not sure if the counts. I know it’s a patent and it could be anything. But it talks about two adjacent dies being used if they’re good or being split if there is a defect.

https://patents.google.com/patent/US20210217702A1/en?oq=2021...

Thanks for the link. I'm not a lithography expert, but this looks like a Cerebras-style approach at a smaller scale. It might be cheaper than the EMIB/InFo approach since there's no interposer with the associated alignment and thickness issues. In the keynote Apple explicitly said they're using a silicon interposer, which doesn't sound like this patent.