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Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by jeswin on Thursday November 25, 2021 @11:32AM (#29342661)
> Some of their processes are _years_ ahead of what anyone else can get their hands on

They are about a year ahead on CPUs. But pretty much everything else (screens, camera sensors, battery) has been on a par with, or behind what everyone else is doing.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by hinkley on Thursday November 25, 2021 @11:52AM (#29342839)
Uh, no?

When they moved away from unibody laptops they did so by introducing friction-stir welding. That was hot tech on Boeing airplanes at the time. Some of those Boeing patents are still active.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by 2muchcoffeeman on Thursday November 25, 2021 @12:53PM (#29343383)
I think I’m terms of pure features that most people care about, other manufacturers are on par.

But Apple products tend to have some really interesting manufacturing or technology. Machining steel for the iPhone 4, FSW, putting an Xbox Kinect into the notch, LiDAR, making edge to edge screens without a chin, custom silicon.

Most of this is easily replaced or omitted because it doesn’t really matter much to the end user.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by solarkraft on Thursday November 25, 2021 @07:23PM (#29346379)
They really add up. Face id was and is pretty "magical". Chins on other phones massively bother me, especially when they are just a tad larger than the side bezels. It's off.

Apple are able to provide unique experiences through their polish and proper concepts. Other manufacturers can even have the features, but they usually don't know what to do with them, make the experience bad and so nobody will care.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by WithinReason on Thursday November 25, 2021 @12:01PM (#29342927)
Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by danuker on Thursday November 25, 2021 @12:06PM (#29342974)
> unibody laptops

You mean the "unibody" made of two sheets of aluminum glued together in a way that the heat unsticks the adhesive?

https://www.youtube.com/watch?v=t7XSckjRPo0

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by hinkley on Thursday November 25, 2021 @12:30PM (#29343193)
That is a 20 minute piece of homework you just assigned. Time offsets please.

The bit I scanned through shows cracking due to dumb placement of holes. And that’s on the lid, not the laptop body.

Drilling holes through the edge of load bearing elements is still a classic failure mode for home construction, so I’m disappointed but not surprised. There’s a lot of bad blood about their hinges, and I’m not gonna fight anybody on that. They wanted the thinnest laptops, they got them, but not without consequences.

But part of that thinness was actually pretty smart, and that’s what we are discussing here. Using billet aluminum and CNC fabrication for complex shapes instead of gluing (gluing takes large contact points which means more material). Switching to airframe construction techniques was cooler and probably faster. Carving them out of solid aluminum was innovative mostly because it sounded so crazy. Stir welding sounded positively sober by comparison, even though it was hot shit at the time.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by raydev on Thursday November 25, 2021 @02:10PM (#29344042)
> You mean the "unibody" made of two sheets of aluminum glued together in a way that the heat unsticks the adhesive? [video link]

No. The unibody was the second gen redesign: https://en.wikipedia.org/wiki/MacBook_Pro#2nd_generation_(Un...

Rossman is handling a first gen MacBook Pro in this video, pre-unibody, and discontinued in 2008.

Not suprised to see Rossman succeeding in mining anti-Apple rage clicks.

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by TMWNN on Thursday November 25, 2021 @05:38PM (#29345649)
>Not suprised to see Rossman succeeding in mining anti-Apple rage clicks.

Rossman's video is about the pre-unibody, but the first-generation unibody indeed had a heat-unsticks-the-adhesive issue. The EM209 issue (<https://randyzwitch.com/broken-macbook-pro-hinge-fixed-free/>) affected me twice, the second time not covered by Apple (<https://news.ycombinator.com/item?id=21542522>).

Re:TSMC “Apple-first” 3nm policy leads to AMD and Qualcomm m... by amelgares on Thursday November 25, 2021 @12:55PM (#29343402)
The laptop in that video is obviously not a "unibody" model. It is a A1260 MacBook Pro 4,1 from early 2008.