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Re:Apple and Intel first to use TSMC 3nm by dfdz on Saturday July 03, 2021 @11:29AM (#27722242)
> 3D integration

In case anyone missed it, AMD announced a basic "3D" design last month

https://www.hpcwire.com/2021/06/02/amd-introduces-3d-chiplet...

Essentially AMD "stacked a 64MB 7nm SRAM directly on top of each core complex, tripling the L3 cache available to the Zen 3 cores."

I am excited to see what comes next!

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