Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at...
by cogman10 on Wednesday June 09, 2021 @11:01AM
(#27448700)
2 limitations.
1. Heat doesn't go away with layers and gets harder to cool.
2. These are still layers. You want each layer to be as flat as possible. As the layers deform you lose the ability to cleanly add more layers.
Current lithography is very much based on the notion that everything is flat.
1. Heat doesn't go away with layers and gets harder to cool. 2. These are still layers. You want each layer to be as flat as possible. As the layers deform you lose the ability to cleanly add more layers.
Current lithography is very much based on the notion that everything is flat.