AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at 2 TB/SEC

Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at... by kevincox on Tuesday June 01, 2021 @09:35AM (#27354186)

But IIUC you would at least need to pass the heat of the CPU though the RAM. So if you want to keep a lot of memory near the CPU you are at the very least adding some sort of "blanket" between the heat source and the heat sink.

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Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at... by nine_k on Tuesday June 01, 2021 @10:18AM (#27354871)

Alternatively, you could put the CPU core on top of RAM, closest to the heat sink.

You also don't want to run your CPU at 80°C, else the RAM will produce much more errors. (ECC is a must anyway, I suppose.)

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Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at... by kevincox on Tuesday June 01, 2021 @10:25AM (#27354975)

You can definitely do that, but now your RAM is twice as far away from the CPU on average than if you put RAM on all sides. The best solution is probably some sort of hybrid where you put RAM on all side, but more on the bottom to balance the thermal effects and the latency.

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Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at... by amelius on Tuesday June 01, 2021 @11:04AM (#27355451)

Thermal resistance is linear wrt the thickness of the material, so if the layer is sufficiently thin, it doesn't form a significant obstacle.

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Re:AMD Demonstrates Stacked 3D V-Cache Technology: 192 MB at... by rbanffy on Tuesday June 01, 2021 @11:37AM (#27356143)

They also mentioned both dies are thinner so they are mechanically compatible with current heat spreaders.

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