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Re:Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era ... by monocasa on Wednesday May 06, 2020 @12:35AM (#23087928)
The custom hardware isn't in the processor chips, it's in the interconnect. In a lot of ways they are groups of coordinated commodity hardware. It's the coordination that's the secret sauce and what you're paying for. Not every problem works great in the tree interconnects you see in data centers, so these systems are big hypercubes. Also the latency is more like PCIe than TCP. In fact PCIe is closer to Infiniband than original PCI in a lot of ways.
Re:Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era ... by gnufx on Wednesday May 06, 2020 @05:24AM (#23089210)
The node interconnect is crucial. However, things like V100s (and presumably the CORAL2 GPUS) are clearly built for high performance computation, if not necessarily "HPC" in this sense; arguably also the nodes used by Sierra/Summit, though IBM seem just to say "AI". K computer was all built for the task, and Fugaku may be similarly impressive. See also the Chinese systems, though it's arguable how successful those designs are. There's also a fair amount of more or less hush-hush work in Europe on HPC custom hardware, though it's not clear that's paying off.

The majority of HPC systems probably use fat tree topologies (including Sierra and Summit as far as I remember). Something to hand which compares fat tree, hypercube, and the dragonfly topology discussed in the article is http://www.hpcadvisorycouncil.com/events/2015/swiss-workshop...

Re:Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era ... by dekhn on Wednesday May 06, 2020 @10:55AM (#23091652)
I recently did an analysis and it looks like for most supercomputers, only 15% of the total price is interconnect. I was surprised- I expected it to be more. Also, most supercomputers aren't hypercubes, they're using things like folded butterfly.
Re:Rosetta: The Engine Behind Cray’s Slingshot Exascale-Era ... by monocasa on Thursday May 07, 2020 @02:25PM (#23106334)
I'm really curious what process you were able to use to separate the component costs on systems like these. The manufacturers go out of their way to obfuscate that information.