New Intel Instructions for Alder Lake, Also BF16 for Sapphire Rapids

Re:New Intel Instructions for Alder Lake, Also BF16 for Sapp... by chx on Thursday April 02, 2020 @01:28PM (#22761373)

ELI5? Not really.

1. The metal pitch targeted (36nm) requires Self-Aligned Quad Patterning (SAQP) apparently is very very hard to do without EUV. TSMC is doing 40nm metal pitch and Samsung does 36nm BUT both of them are using EUV.

2. Cobalt https://fuse.wikichip.org/news/525/iedm-2017-isscc-2018-inte...

3. COAG https://www.reddit.com/r/AMD_Stock/comments/dk2pw7/why_it_is...

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Re:New Intel Instructions for Alder Lake, Also BF16 for Sapp... by Symmetry on Thursday April 02, 2020 @01:58PM (#22761704)

I think the ELI5 is "Intel tried to do some things that were cleverer than they could actually do and messed up."

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Re:New Intel Instructions for Alder Lake, Also BF16 for Sapp... by scottlocklin on Thursday April 02, 2020 @05:49PM (#22764265)

I remember them developing an EUV lithography rig at the ALS 11 bend magnet in the 90s... guess it never worked out. Looking at the website: dude's still there!

Thanks for the explanation; close enough to ELI5

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