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A comment on Tin Plasma Extreme Ultraviolet Radiation Makes 5nm Integrated Circuits Possible. Parent comment

Re:Tin Plasma Extreme Ultraviolet Radiation Makes 5nm Integr... by deepnotderp on Wednesday September 04, 2019 @12:07AM (#20873914)
The advantage would be interconnect energy and performance.

To an extent this has already happened with wafer scale integration, e.g. cerebras.

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Re:Tin Plasma Extreme Ultraviolet Radiation Makes 5nm Integr... by olliej on Wednesday September 04, 2019 @03:30PM (#20880589)
The problem is the increase power usage of the additional caches that are necessary - modern CPUs already need a bunch of physically local caches in addition to the large L1/2/3/n caches because of timing of flowing electrons from A to B. At some point the benefit of larger single die becomes minimal. The moment that happens you benefit from making separate chips because of increased yield.
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