Re:Ti NE555 – real vs fake: weekend die-shot
by qb45 on Monday July 03, 2017 @05:14AM
(#14686928)
> manufacture empty packages
That's the crux. You don't buy mass-produced empty packages to put the parts in. Packaging happens by putting the IC die, pins and bonding wires which connect them together inside a mold and filling it with plastic.
It's probably cheaper and certainly lower-tech to replace markings on existing chip than produce a new one.
That's the crux. You don't buy mass-produced empty packages to put the parts in. Packaging happens by putting the IC die, pins and bonding wires which connect them together inside a mold and filling it with plastic.
It's probably cheaper and certainly lower-tech to replace markings on existing chip than produce a new one.