This paper is closer to industrialization than most and I expect production on scale in less than 10 years. It uses process steps that are already operating on an industrial scale. It's achieved on an industrial area wafer (compare with many academic records where cells are tiny, less than 10 cm^2). It's achieved on an industrial thickness wafer (some records use thinner wafers that are closer to the theoretical optimum, but those thinner wafers are too fragile to process industrially with current technology). It's just combining features of two cell concepts that are already manufactured on an industrial scale (interdigitated back contact cells and heterojunction cells). The core patents on heterojunction silicon cells expired just a few years ago so I expect more vanilla heterojunction and heterojunction-plus-other manufacturing going forward.