My solution was to print the TCB on a process node that was verifiable by eye. Then, verify a random sample of each batch. Possibly speed it up with image processing algorithms if producing the same component or components.
Note: Deviations from intended circuitry in deep sub-micron can have measurable differences at analog or RF level. DARPA is funding research to do such things. A monitor at visible node could then be combined with CPU's on cutting-edge node. Common practice in commercial sector is obfuscations, though.
https://news.ycombinator.com/item?id=10468624
My solution was to print the TCB on a process node that was verifiable by eye. Then, verify a random sample of each batch. Possibly speed it up with image processing algorithms if producing the same component or components.
Note: Deviations from intended circuitry in deep sub-micron can have measurable differences at analog or RF level. DARPA is funding research to do such things. A monitor at visible node could then be combined with CPU's on cutting-edge node. Common practice in commercial sector is obfuscations, though.