Re:Linus Torvalds worries about how Linux will handle end of...
by Someone on Thursday September 19, 2013 @03:56AM
(#6410412)
That only helps with the 'size' problem, which we do not really have; it does nothing [1] with the 'power' problem, and the related 'heat' problem.
If you stack 20 ARM CPUs in a single package, it fits in your phone, but it will burn it, too, if it does not run out of its battery first.
[1] Maybe a little bit, as 3D allows for slightly shorter connections.
When shrinking is over we'll start going up - i.e. 3D chips. Intel already uses basic 3D in their FinFET process. 3D memory chips available commercially for some time.