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Re:Using voltage glitching to unleash the A100 in my mining ... by mschuster91 on Wednesday November 11, 2026 @08:43AM (#50453332)
> In one of the most extreme manifestations of product segmentation, the CMP 170HX, an Ethereum mining card with nominally 8 or 10 GB of application-exposed framebuffer capacity, actually comes with, respectively, ~80 and ~40 GB of HBM onboard!

wtf, it seems RAM truly was too cheap back then...

Re:Using voltage glitching to unleash the A100 in my mining ... by throwaway_new_1 on Wednesday November 11, 2026 @09:02AM (#50453562)
Scaling according to demand is way too hard when it comes to silicon.
Re:Using voltage glitching to unleash the A100 in my mining ... by mitxela on Wednesday November 11, 2026 @09:25AM (#50453824)
Nvidia might've been planning to eventually buy them back from the miners, or sell software RAM unlocks.
Re:Using voltage glitching to unleash the A100 in my mining ... by jeroenhd on Wednesday November 11, 2026 @09:40AM (#50454007)
The card was initially priced at over 4 grand and it had its capabilities severely reduced to make it not compete with real GPUs.

Plus: most of those cards probably have broken RAM chips anyway. Throwing them out would be a waste, limiting trash chips to a small amount of RAM that does work turns recycling costs into a product that can be sold for money.

Re:Using voltage glitching to unleash the A100 in my mining ... by pwg on Wednesday November 11, 2026 @09:52AM (#50454181)
The marginal cost to fabricate the GPU die with the full ram allotment, and then disable a portion for 1) salvaging otherwise useless die's with partly bad ram for lower ram use cards; or 2) market segmentation; is tiny compared to the marginal cost of creating X different masks and fabricating X different die's, one specific to each market segment/ram size amount.

In addition, fabricating the same die for every SKU point in the product line means the maker does not have to guess how many version X vs. version Y vs. version Z dies to fabricate. The just have one fabricated. Then the dies become SKU version X, Y or Z as demand requires during the card assembly process.