Re:Nvidia's RTX Pro 6000 has 96GB of VRAM and 600W of power
by nomel on Tuesday March 18, 2025 @06:14PM
(#43405815)
For that H100 image, how do they get the top surface of all the chips on the same plane? Do they solder them "upside down", so the chips are sitting on a reference plane, and the PCB is allowed to "float"? Or is the soldering controlled enough that they can just heat and be done?
https://en.wikipedia.org/wiki/Apple_M1#/media/File:Mac_Mini_...
You could call that on-package, but it's not on-package in the same way that GPU HBM is, with that the main die and memory dies are packaged together on the same substrate. That's a much more difficult and expensive process, apparently packaging is the main bottleneck for H100/H200 production.
https://i.imgur.com/hFTPyjk.jpeg