Re:Apple M3 Ultra
by InTheArena on Wednesday March 05, 2025 @09:51AM
(#43267247)
I RTFA, RMFP
The comment was that the press had reported that the interposer wasn't available. This obviously uses some form of interposer, so the question is if the press missed it, or Apple has something new.
> uses an _embedded_ silicon interposer
It sounds like they're using TSMC's new LSI (Local Si Interconnect) technology, which is their version of Intel's EMIB. It's essentially small islands of silicon, just around the inter-chip connections, embedded within the organic substrate. This gives the advantages of silicon interconnect, without the cost and size restrictions of a silicon interposer. It would not be visible from just looking at the package.
https://www.anandtech.com/show/16031/tsmcs-version-of-emib-l...
https://semianalysis.com/2022/01/06/advanced-packaging-part-...
> Apple’s custom-built UltraFusion packaging technology uses an embedded silicon interposer that connects two M3 Max dies across more than 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth, and making M3 Ultra appear as a single chip to software.