Every story and comment from the Hacker News API, in a layout borrowed from 2001.
A comment on TSMC experimenting with rectangular wafers vs. round for more chips per wafer. Parent comment
The interposer is the layer between chips and their package. Per RTFA, TMSC is trying to fit more chips per interposer.
Neat.
There are no comments on this comment yet.
The interposer is the layer between chips and their package. Per RTFA, TMSC is trying to fit more chips per interposer.
Neat.