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Re:TSMC experimenting with rectangular wafers vs. round for ... by Out_of_Characte on Saturday June 22, 2024 @03:30PM (#40761500)
No you can't. Anyone whose spent any time breaking glass into specific shapes knows how difficult it is. Glass can't handle the force required to break it in one go. Multiple perfect passes have to be made in order to do it with reasonable yield. Having corners inside your fault lines is asking for trouble. Chips arent that much different.
Re:TSMC experimenting with rectangular wafers vs. round for ... by londons_explore on Saturday June 22, 2024 @04:40PM (#40762011)
This is silicon we're talking about... It can easily be cut with a wire saw, and while that is usually in a straight line, it doesn't need to be.