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A comment on TSMC experimenting with rectangular wafers vs. round for more chips per wafer. Parent comment

Re:TSMC experimenting with rectangular wafers vs. round for ... by phkahler on Saturday June 22, 2024 @10:34AM (#40759407)
I'm not sure how chips are cut from a wafer, but long straight cuts can be used for a grid. If it's more like laser cutting via CNC then shape might not matter.
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