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Re:ASML Aims for Hyper-NA EUV, Shrinking Chip Limits by deff on Friday June 14, 2024 @07:27AM (#40679749)
Dichalcogenides in a 2D layer like WS2 or MoS2 for example. These can already be grown on silicon wafers but are hard to integrate with other materials.

https://en.wikipedia.org/wiki/Transition_metal_dichalcogenid...

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