TQFP can be done with common and cheap items like a cheap soldering iron, a flux pen, some copper wick and a pair of tweezers.
Here's someone who wrote about the proposed approach: http://www.instructables.com/id/Toaster-Oven-Reflow-Solderin...
It goes something like this:
- Mask everything around the component to be soldered with masking tape
- Flux as usual
- Place component down and align it
- Tack on the corners in order to ensure alignment
- Don't worry about solder bridging
- Now, apply solder to the pins
- Use a healthy dose
- You actually want an entire row to be brideged
- You should see a solid strip of solder across all pins
- Get all four sides done the same way
- Now, take the iron and heat up one of the beads of solder to the melting point
- Without any delay, hit the board edge-wise on the table
- The molten solder will come flying out
- A small amount of solder (just enough) will remain on the pins
- With practice you can get perfect factory-looking joints with no bridging whatsoever
It takes a little practice, but I have found that if you need to do a lot of TQFP's this technique, once mastered, works far better than trying to apply solder precisely. It's messy at first and you might even ruin some parts. Once the technique is perfected it works amazingly well and it is very fast.Obviously, if you have a lot of parts on a single board you are entering territory where reflow soldering in an oven is a far better idea.
Having done boards with FPGA's as large as 1152 balls (definitely not soldered by hand) I can tell you that good board houses produce good product and the difference wouldn't be much, if any between a controlled-impedance board for an A10 project versus an equivalent-sized BGA device.
This is important, so I'll repeat it: The A10 requires a controlled-impedance board.
EDIT: Just learned that the A10 requires DDR3. So BGA's are the order or the day. Hand-soldering with a soldering iron is simply not a reality for such a board. If you want to assemble one yourself you have to use a stencil and an oven or hot plate for reflow. Not that hard for small quantities.
I should also note that I've only done this when absolutely necessary. It makes a lot more sense to pay to have SMT boards assembled. It's not that expensive and assembly shops have all of the right equipment to get it right. With BGA's you really need to have full inspection (including X-Ray) in order to ensure proper attachment. This is particularly true in the case of high-speed boards.