Re:ASML to Ship First High-NA EUV Tool This Year: $300M per ...
by reportingsjr on Thursday September 07, 2023 @11:44AM
(#37420678)
You hit the nail on the head.
SMIC can get a bit further with DUV, but they are certainly going to get eaten up with multi patterning. The additional cost and complexity from this will be significant.
SMIC can get a bit further with DUV, but they are certainly going to get eaten up with multi patterning. The additional cost and complexity from this will be significant.